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| Application: Used for back side thinning
and front side precision grinding of silicon wafer |
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Features
1. Variouse direction of producing chemicals or metallurgical
products. Provide with high efficiency of grinding and
durable lifetime..
2. Stably manufacture technics. Provide with fine roughness
of water surface. |
Specfication:
Bond : Resin, Vitrified
External diameter: 175, 195, 209, 305,335.
Grit size: 100#--3000# ( 8000# in developing )
Applicable Equipment: Be used on machines manufactured by DISCO, OKAMOTO, TSK, STRASBAUGH ect.
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A wide range of shapes and sizes is available for toolroom
and production use. We are ready to manufacture
any type of diamnd tools according to the specifications of
our clients. If you have any requirements, Please contact
us by E-mail
for details.
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