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Features
1. Provide with high cutting speed, high efficiency and
durable lifetime.
2. High precision in grooving and cutting.
3. High combine rigidity, Maintain high cutting ability
in the working condition of high speed rotation and fast
feed speed.
Application: Used for the egde forming and grinding of wafer or PDP and TFT-LCD glass
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specification:
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D
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H
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T
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Bond
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Grit
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Groove
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diameter 50--250
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Size on requirest
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3--20
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Metal or resin
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325--800
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1--10
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A wide range of shapes and sizes is available for toolroom
and production use.
We are ready to manufacture any type of diamnd
tools according to the specifications of our clients. If you
have any requirements, Please contact us by E-mail
for details.
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